Test Report - SILICON MACHINING

Test. No.: 212009
Machine Type: HSPC
Special Equipment: Yes
Number of Drawing:
Material Indication: Silicon
Program set-up: Kern
Cooling and lubrication: compressed air

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Test 1: Pocket hole
A pocket hole of diameter 1,0 mm and depth 0,5 mm was milled. As shown on the picture the edge is perfect without defects.
Processing time 3 minutes.

KERN
Micro- und Feinwerktechnik
GmbH & Co. KG

Subcontracting
plant Murnau-Westried:

Ammergauer Str. 11
82418 Murnau-Westried
Germany

Phone: +49-(0) 8841-6130-0
Telefax:+49-(0) 8841-6130-420

Machine tools
plant Eschenlohe:


Olympiastr. 2
82438 Eschenlohe
Germany

Phone: +49 (0) 8824 9101-0
Telefax: +49 (0) 8824 9101-124


Test 2: Rectangle hole (breakthrough)
A rectangle hole of 3 x 1 mm was milled into a
wafer of 0,566 mm thickness. The sharpness of the edge is good.
Processing time 7,5 minutes.

Conclusion:
The good results achieved are a result of the combination of:
- A high quality machine, which is rigid and stable, and has no vibration in the working area
- The milling strategies employed.
- The speeds and feeds chosen in conjunction with the correct cutting tool.
- The workholding system
- The swarf removal and cutting tool cooling and lubricating system.


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